Technology & R&D
Advanced Manufacturing Needs
As electronic products continue to evolve toward higher performance, greater integration, and increased reliability, manufacturing technologies must advance accordingly. At Lin Horn Technology, we continuously invest in technology development and process optimization to strengthen our manufacturing capabilities and support the evolving needs of our customers.
Process Stability & Scalability
Our R&D efforts focus on improving process stability, yield, and manufacturability, while steadily enhancing our ability to support higher layer counts, finer features, and more demanding application requirements. Through close collaboration between engineering, production, and quality teams, we translate technical development into reliable, scalable manufacturing solutions.
Reliable Long-Term Capability
Guided by a long-term roadmap, Lin Horn remains committed to advancing its process capabilities in a disciplined and sustainable manner—ensuring consistent quality, stable supply, and dependable support for our customers’ future products.
Technical Domains and Future Road Map
| Current / Standard | 2027 / Advanced | 2028 / Innovative | |
|---|---|---|---|
| Max Layer Count | 18L | 22L | 26L |
| HDI Capability | 1+N+1 | 2+N+2 | 3+N+3 |
| Final board thickness | 3.2mm | 3.6mm | 4mm |
| Minimum drill size | 8 mil (0.20 mm) | 6 mil (0.15 mm) | 6 mil (0.15 mm) |
| Laser Via | 4 mil (0.10 mm) | 4 mil (0.10 mm) | 4 mil (0.10 mm) |
| Backdrill residual copper | 6+/-4mil | 6+/-3mil | 6+/-3mil |
| Aspect Ratio | 1:12 | 1:20 | 1:26 |
| Minimum dielectric thickness | 3 mil | 2.5 mil | 2.3 mil |
| Line width / line space (inner layer) | 3 mil / 3 mil | 2.5 mil / 2.5 mil | 2 mil / 2 mil |
| Line width / line space (out layer) | 3 mil / 3 mil | 2.5 mil / 2.5 mil | 2 mil / 2 mil |
| Impedance Tolerance | ±10% | ±8% | ±7% |
| Solder mask registration | 75μm | 50μm | 50μm |