About Us
Founded in 1995
Lin Hong Technology specializes in multilayer PCB manufacturing and sales
We continuously enhance our technology, processes, and management to meet the rapidly changing electronics industry.
With a customer-first philosophy, we deliver high quality, advanced technology, competitive pricing, and on-time delivery. Upholding the spirit of partnership and mutual growth, we strive to build long-term, win-win relationships with our clients and suppliers.
Advanced PCB Manufacturing Processes
Advanced PCB manufacturing up to 22 layers, supporting HDI, blind/buried vias, via-in-pad, and back drilling. Expertise in heavy copper and low-loss materials ensures precision and reliability.
Layer Count
2-20 layers
Board Thickness
0.3–3.2 mm
Minimum Trace / Space
2.5 mil
Minimum Hole Size
4 mil / Aspect Ratio 1:16
Materials
FR4 / High TG / Low DK & Low DF / Aluminum Core / Rogers
Surface Finish
SP / ENIG / Immersion Ag / Lead-Free HASL, etc.
Impedance Control
±8-10%
Layer Count
2-20 layers
Board Thickness
0.3–3.2 mm
Minimum Trace / Space
2.5 mil
Minimum Hole Size
4 mil / Aspect Ratio 1:16
Materials
FR4 / High TG / Low DK & Low DF / Aluminum Core / Rogers
Surface Finish
SP / ENIG / Immersion Ag / Lead-Free HASL, etc.
Impedance Control
±8-10%
Diverse PCB Solutions
for Every Industry
Intelligent Driven Sustainability · ESG Empowering Tomorrow
Driven by innovation and smart manufacturing, we are committed to sustainable development — from energy efficiency to responsible supply chain management. ESG is not just a concept; it is the driving force behind everything we do.
ESG
